Compressible board substructure formwork (3)

Compressible board substructure formwork are described by characteristics such as material, thickness and recycled content (minimum). An example use may be within an in situ reinforced concrete pilecap and ground beam foundation system.

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  • Cellcore HX Plus

    Cordek Ltd

    Collapsible void former with integral insulation for use under reinforced concrete floor slabs. The product has a number of variables including panel depth, thermal and loading characteristics.

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    • Manufacturer:Cordek Ltd
    • Uniclass 2015:Pr_25_71_29_16
    • NBS Reference:45-50-30/390
    • Last Updated:19th Jun 2018
  • Cellcore HX B

    Cordek Ltd

    Collapsible void former for use under reinforced concrete ground beams and pile caps. The product has a number of variables including panel width, depth and loading characteristics.

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    More Information

    • Manufacturer:Cordek Ltd
    • Uniclass 2015:Pr_25_71_29_16
    • NBS Reference:45-50-30/390
    • Last Updated:19th Jun 2018
  • Cellcore HX S

    Cordek Ltd

    Collapsible void former for use under reinforced concrete floor slabs. The product has a number of variables including panel depth and loading characteristics.

    Tags:
    Download
    Add to bundle

    More Information

    • Manufacturer:Cordek Ltd
    • Uniclass 2015:Pr_25_71_29_16
    • NBS Reference:45-50-30/390
    • Last Updated:19th Jun 2018